Bidding NO :0664-2540SUMECF08/03
Bidding Content:Thin glue leveling and developing machine
Bidding Agency:SUMEC INTERNATIONAL TECHNOLOGY CO., LTD.
Purchasers:Anhui Huaxin Weina Integrated Circuit Co., Ltd.
Open-Time of Bids:2025-06-04 09:30
Ending Date of Evaluation Result:2025-07-03 23:59
Who proposed the successful bidder:
| rank | Proposed Bid-winner | Manufacturer | Manufacturer Country |
|---|---|---|---|
| 1 | NINGBO ALLSEMI MICROELECTRONICS EQUIPMENT CO.,LTD | NINGBO ALLSEMI | China |
| 2 | lebo | lebo | China |
| 3 | TDSEMI | TDSEMI | China |
